Single Board Computer

Product Details:

Onboard Intel 11th Gen Tiger Lake-U series processors; ◆ 2 DDR4 SODIMMs, up to 64GB; ◆ TPM2.0 (optional); ◆ 1 HDMI2.0, 1 VGA, 1 LVDS/EDP (optional); ◆ 1 PCIe_X4 interface, PCIe3.0_X2; ◆ 2 Intel i225 2.5G network port (single network optional); ◆ 6 COMs; 1 Key-E

Additional Information:

• Production Capacity: 500
• Delivery Time: 10 - 12 DAYS AFTER PO AND PAYMENT

Product Details:

SINGLE BOARD COMPUTER
DM&P SoC Vortex86DX- 800MHz
256MB / 512MB DDR2 onboard
4S/2U/VGA/LCD/LVDS/LAN/LPT/PWM/SPI/16GPIO/CF/IDE
Operation Temperature: -20 ~ +70°C / -40 ~ +85°C (Optional)
Onboard 4MB SPI Flash Disk
Optional: USB Audio Controller

Additional Information:

• Production Capacity: 1000/month
• Delivery Time: 2 WEEKS
• Packaging Details: SBC AND CONNECTOR CABLES

Product Details:

Product Specification Sheet:

Product Details:

• The IB892 embedded board utilizes the Intel® Platform Controller Hub EG20T and the 45nm Intel® Atom™ processors E620T clocked at 600MHz and E660/E660T at 1.3GHz. The Intel Atom processor E6xx series supports up to 2GB of DDR2 SDRAM onboard at 800MHz. The IB892 is intended for embedded applications including in-vehicle infotainment devices, digital signage, medical and industrial applications requiring wide operating temperatures.

 

• Measuring 102mm x 147mm, the IB892 offers essential features and high-speed connectivity including PCI-E Gigabit LAN, Watchdog timer, 4x USB 2.0 ports, 4x COM ports, 2x SATA II, CF socket and a Mini PCI-E socket. The board supports dual display (DVI/LVDS) and features high-definition audio.

Product Details:

Product Specification Sheet:

Product Details:

Model no: STS 25C-25, Interface: SATA 3.2 (6Gb/s),Capacity: 30GB~960GB,Form Factor: 2.5",NAND Flash Type: 3D TLC, External DRAM: No Sequential Read Performance (MB/sec): Up to 560, Sequential Write Performance (MB/sec): Up to 520, Connector: (7+15) pin male, ECC Engine: Low-Density Parity-Check (LDPC) Code, IOPS (4K Random Write): 73K,  Extended Operating Temperature ( °C ): -40 ~ + 85, Storage Temperature ( °C ): -40 ~ + 100,Thermal sensor: No, Dimension: 7mm:100.00 x 69.85 x 6.90 (mm), Operating voltage: 5.0 V±5%, Power consumption: Active mode: 330 mA / Idle mode: 95 mA

Product Details:

Model no: STS 25V-25, Interface: SATA 3.2 (6Gb/s), Connector: (7+15) pin, Form Factor: 2.5", NAND Flash Type: 3D TLC, Capacity: 120-960GB, External DRAM: No, Sequential Read Performance (MB/sec): Up to 560, Sequential Write Performance (MB/sec): Up to 485, ECC Engine: Low-Density Parity-Check (LDPC) Code, IOPS (4K Random Write): 62K, Extended Operating Temperature (°C): -40°C to 85°C, Storage Temperature (°C):M-55°C to 100°C, Thermal Sensor: Yes, Shock: Operation: 50G/11ms(compliant with MIL-STD-202G)Non-operation: 1500G/0.5ms(compliant with MIL-STD-883K), Vibration: Operation: 7.69 Grms, 20~2000 Hz/random(compliant with MIL-STD-810G)Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine(compliant with MIL-STD-810G), Operating Voltage: 5.0 V ± 10%, Power Consumption: Active mode: 260 mA / Idle mode: 50 mA, Dimension (L x W x H ): 7mm:100.00 x 69.85 x 6.90mm, MTBF (hours)>: 3,000,000, Technology: AES 256-bit Encryption / ATA Secure Erase / Conformal Coating / DEVSLP / End-to-end Data Protection / Over-provisioning / Page Mapping / S.M.A.R.T. / Smart Read Refresh™ / SSDWidget 2.0 / Thermal Sensor / Wide Temperature / Write Protect, Application: Factory Automation / Gaming / Healthcare / Internet of Things / Server & Networking / Transportation

Product Details:

Qseven - The name Q7 is derived from “quadratic,” as noted by the Q, and seven refers to the 7 x 7 cm (70 x 70mm) size of the module. This technology evolution is built upon a more petite size footprint mobile processor and chipset. The Qseven module standard provides high-performance and low power consumption interfaces for mobile and battery-operated applications with a standard power consumption equal to or less than 12W, which matches application requirements for fan-less operations by way of heat spreader mechanical interfaces. Unlike other module standards, Qseven does not require an expensive board-to-board connector. It utilizes a very affordable MXM card slot with 230 pins in a 0.5 mm configuration. This slot is already being used for graphics cards in laptop computers, so it is capable of high-speed PEG data transfers. PQ7-C201 - Mini-ITX Form Factor Carrier Board For Qseven Module. Mini-ITX Form Factor Carrier Board For Qseven Module with Multiple Displays and One GbE.PQ7-M106IL-E - Portwell’s PQ7-M106IL-E is designed with Intel Atom processor E3800 series. PQ7-M106IL-E features lower power consumption than previous Atom based platforms, and 2GB to 8GB memory support. It also supports an extended -40C to 85C temperature with qualified industrial-grade components. PCI Express interface can support expansion devices, such as GPS, GPRS, Wireless, Bluetooth, Graphic, etc.; also the SDIO signal assists extra storage requirement. USB3.0 is a new feature different from that of previous Qseven design, as more and more customers require faster data transfer. PQ7-M106IL-E is the ideal solution for various automation or equipment applications.PQ7-M108 - Qseven module by Qseven 2.1 based on Intel® Atom® / Pentium® / Celeron processors (Apollo Lake) with LPDDR4 SDRAM up to 8GB, 24bit LVDS, DP/HDMI. PQ7-C100XL-CAN - More and more places utilize some form of a kiosk, e.g. airports, museums, ATMs, etc. This module comes equipped with a single DVI interface for high resolution. Its D/C input reduces the power use while the Mini PCI Express make upgrades simpler.PQ7-C100XL-CAN has CAN bus for vehicle application. In addition, 3.5″ board size can fix in thin client system with Qseven module. Furthermore, for speeding up developing stage, Portwell provides carrier board design guides as well for customer’s own carrier board development reference.

 

PQ7-C200

Portwell’s PQ7-C200 is designed with a Qseven 230pin card edge MXM connecter and supports Portwell’s Qseven modules for initial evaluation testing on PCI-E, Mini PCI-E, VGA/LVDS, SATA, LAN, AUDIO, SDIO, LPC function, etc.

PQ7-C200 offers PCI signal for PCI expansion demand, and also simultaneously supports IDE and SATA ports. Furthermore, Portwell can provide carrier board design guides for your carrier board development reference to shorten the development stage.

 

PQ7-M640F

Freescale iMX6 Family based Qseven Module Board for Mini-ITX. Qseven Module based on Freescale® i.MX6 Family Processor, support up to 4GB DDR3 SDRAM, LVDS/HDMI® Display, gigabit ethernet and SSD/SATA storage.PQ7-M107 - Intel Celeron and Pentium Processor N3000 based Qseven Module Braswell SoC. Portwell’s PQ7-M107 is designed with Intel® Celeron® and Pentium® processor N3000 product families (4W~10W), formerly codenamed Braswell, delivering greater CPU and graphics performance over the previous generation entry-level CPUs from Intel while operating with lower power consumption and lower TDP. With greater performance and memory bandwidth support, the PQ7-M107 is an ideal building block for solutions for manufacturing, transportation and automation applications. In addition, the PQ7-M107 features HD camera with MIPI CSI-2, 4k x 2k resolution and three independent displays.

Additional Information:

• Production Capacity: 500
• Delivery Time: 10 - 12 DAYS AFTER PO AND PAYMENT

Product Details:

SMARC (Smart Mobility ARChitecture) is an intelligent solution for embedded systems and IoT projects. SMARC’s compact size and standardized interfaces suit it for industrial automation, medical equipment, and transportation systems. A computer-on-module (COM) standard sets size, power supply, and interface guidelines for a compact, integrated design. The Standardization Group for Embedded Technologies (SGET) manages the SMARC standard, which top module and board manufacturers widely use. 

PSMC-M640F PSMC-M640F is design as CPU module series with SMARC form factor. It is based on embedded Freescale™ i.MX6 processor, an ARM® Cortex®-A9 processor, Single, Dual and Quad-Core.

The SMARC (Smart Mobility ARChitecture), small form factor of lower power, cost concern, and high performance, is used as building blocks for portable and stationary embedded systems. The SMARC pin-out is optimized for the features common to ARM CPUs and not common to the x86 PC world. The modular approach allows scalability, fast time to market and upgradability while still maintaining cost performance, low power and small physical size.

PSMC-C300ARM

 

The pin-out of PSMC-C300ARM is optimized for the features specifically common to ARM® processors. The modular approach allows scalability, fast time to market and upgradability while still maintaining low power and cost performance.

PSMC-M101SMARC module by SMARC 2.0 based on Intel® Atom™ / Pentium® / Celeron® processors (Apollo Lake) with LPDDR4 SDRAM up to 8GB, 24bit LVDS, DP, HDMI.  PSMC-M101 is designed withIntel® Atom™/ Pentium®/ Celeron® processors (“APOLLO LAKE”)  processors featured with higher graphic performance and wider memory bandwidth than the previous platform. Based on Intel Apollo Lake industrial grade processor support, industrial components selecting, and with wide-voltage input design adding on board, PSMC-M101 not only aims at various applications(i.e. automation, fire security, transportations), but is also set to support kinds of harsh environment with a stable power input.

Additional Information:

• Production Capacity: 500
• Delivery Time: 10 - 12 DAYS AFTER PO AND PAYMENT

Product Details:

Carrier BoardDevelopment boards (Carrier Boards)Portwell’s COM-Express®, Qseven and SMARC development (carrier) boards help customers evaluate and establish customer application programs before starting the carrier board design. It can be used as a reference design to reduce customers’ design effort and assess performance and computing reliability early.

PCOM-C605R

Portwell PCOM-C605R is a Mini-ITX size carrier board that supports reverse mounting of COM Express Type6 module. It follows COM Express Rev 3.1 standard, supporting multiple I/O interfaces, including DP display, VGA, PCIe, M.2, RJ45, USB 3.2(Type-A), SATA, UART and Audio jack.

PCOM-C605R suitable as a solution for compact size system, which offer an effective next-generation product upgrade path for solutions already using the previous PCOM-C605 based system products. For more product features, please contact your distributor or refer to the datasheet/user manual.

PCOM-C605Portwell PCOM-C605 is designed to as a validation board for most of the Portwell COM-Express 2.1 type 6 modules, this carrier will support VGA, LVDS, DP, HDMI® displays, and included multiple I/O expansions, for example PEG, PCIe, USB3.0. SATA III and CFEX.


PCOM-C615
PCOM-C615 is PICMG 1.3 Full Size Form Factor Evaluation Carrier Board for COM Express® Revision 2.0 Type VI Module. PCOM-C615 follows standard PICMG 1.3 golden finger pin definition and let customer save system total cost for easily upgrading modules. Portwell PCOM-C615 is designed with PICMG 1.3 form factor with COM Express Type VI row connectors, suitable for evaluation testing of Portwell’s Type VI COM Express modules on PCIe, PEG, VGA/HDMI®, DVI, USB and SATA interface.

PCOM-C60B
Portwell PCOM-C60B is designed to as a validation board for most of the Portwell COM-Express 3.0 type 6 modules, this carrier will support VGA, eDP/LVDS, DP displays, and included multiple I/O expansions, for example PEG, PCIe, USB3.2, SATAIII and 2.5G ethernet.

PCOM-C701ATX Form Factor Evaluation Carrier Board for COM Express Revision 3.0 Type VII Module with 4x 10GbE Support with Inphi CS4227 PHY. Portwell PCOM-C701 is designed with ATX form factor with COM Express Type VII row connectors; it’s suitable for evaluation testing of Portwell’s Type VII COM Express modules with 4x USB 3.0, 32x PCIe lanes, 4x 10 Gigabit Ethernet, and BMC AST2500 support. Portwell is able to provide carrier board design guide for customer to design their carrier board as a reference. This can shorten customer’s carrier board developing time and make the development quick and easy. The PCOM-C701 provides COM Express Type VII support in addition to fulfill wide range of device connectivity for prototype and flexibility.

Additional Information:

• Production Capacity: 500
• Delivery Time: 10-12 DAYS AFTER PO AND PAYMENT

Product Details:

Model no: STS25P-M280, Interface: SATA 3.2(6Gb/s),ConnectorM.2 B & M key, Form FactorM.2 2280-D5-B-M, NAND Flash Type3D TLC, Capacity120GB-960GB, External DRAM: No, Sequential Read Performance (MB/sec)Up to 555, Sequential Write Performance (MB/sec)Up to 490, ECC EngineLow-Density Parity-Check (LDPC) Code, IOPS (4K Random Write)69K, Extended Operating Temperature ( °C )-40 ~ + 85, Storage Temperature ( °C )-55 ~ + 100, Thermal SensorYes, Shock: Operation: 50G/11ms (compliant with MIL-STD-202G), Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K), Vibration: Operation: 7.69 Grms, 20~2000 Hz/random(compliant with MIL-STD-810G)Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine(compliant with MIL-STD-810G), Operating Voltage3.3 V ± 5%, Power Consumption: Active mode: 425 mA / Idle mode: 70 mA. Dimension (L x W x H ): 80.00 x 22.00 x 3.88 (mm), MTBF (hours): >3,000,000, Technology: AES 256-bit Encryption / ATA Secure Erase / Conformal Coating / CorePower / DataRAID™ / DEVSLP / End-to-end Data Protection / Page Mapping / S.M.A.R.T. / Smart Read Refresh™ / SSDWidget 2.0 / Thermal Sensor / Wide Temperature / Write Protect, Application: Factory Automation / Gaming / Healthcare / Internet of Things / Server & Networking / Transportation

Product Details:

Model no: STS V25C-M280, Interface: SATA 3.2 (6Gb/s), Connector: M.2 B and M Key, Form Factor: M.2 2280-D5-B-M, NAND Flash type: 3D TLC, Capaciity: 30GB to 960GB, Sequential Read Performance (MB/sec): upto 560, Sequential Write Performance (MB/sec): upto 520, IOPS (4K Random Write): 73K, ECC Engine: Low-Density Parity-Check (LDPC) Code, Extended Operating Temperature ( °C ): -40 to +85, Storage Temperature ( °C ): -40 to +100, Shock: Operation: 50G/11msNon-operation: 1500G/0.5ms, Vibration: Operation: 7.69 Grms, 20~2000 Hz/random Non-operation: 4.02 Grms, 15~2000 Hz/sine, Operating Voltage: 3.3 V ± 5%, Power consumption: Active mode:455 mA / Idle mode: 80 mA, Dimension (LxWxH): Single side: 80.00 x 22.00 x 2.38 (mm) Double side: 80.00 x 22.00 x 3.88 (mm), Technology: ATA Secure Erase / Conformal Coating / CoreAnalyzer2 / CoreSnapshot Lite / DataDefender™ / DataRAID™ / DEVSLP